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Electronic giant Samsung planning to put in chip production ability at China its manufacturing base

siliconreview Electronic giant Samsung planning to put in chip production ability at China its manufacturing base

One of the most popular electronic giant Samsung Electronics Co Ltd recently publicized that  it is considering adding memory chip production capacity at its manufacturing base in China in the middle of an industry-wide boom that will probable boost record sales for memory suppliers.

According to a Samsung spokesman, the firm was bearing in mind adding capacity at its facility in Xi’an but no particulars, including the possible investment amount and what products it would make with the additional resources, had been decided.

Established as the world’s No.1 memory chip maker, Samsung has so far invested $7 billion in the Xi’an facility to make 3D NAND memory chips. All the manufactured chips are used for high-end data storage products on electronic devices such as smartphones, personal computers and data servers.

According to few reports by South Korean media, Samsung was already in talking terms with the Chinese authorities to add 3D NAND chip capacity in Xi’an, and it is been ascertained that construction could begin before the year-end.

Well it is ascertained that the South Korean firm and few other memory chip companies are likely to take pleasure in record revenue and profits in 2017, determined by growing demand for more processing firepower in consumer electronics, and retreating production give way on investment as technology grows more sophisticated. Researcher IHS expects this year’s memory industry revenue jump 32 percent to a record $104 billion.

The big industry executives and analysts say that the 3D NAND suppliers will probably fight to keep up with orders from clients all through 2017. Samsung and its rivals have been boosting 3D NAND investment accordingly. While Samsung has so far not given precise targets, it said in April that capital expenditures would rise considerably this year in part due to its plans to enhance 3D NAND production capacity.

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